It is the prober with high-speed probing that targets non-memory device. Probing Machine: UF2000 Most significant machine model for 200mm wafers High precision, high rigidity machine. Uf200 Prober Manual PDF: Uf200 Prober Manual Doc: Uf200 Prober Manual ePub: Uf200 Prober Manual If you are searching for a ebook Uf200 prober manual in pdf form, in that case you come on to the right website. We furnish the full option of this book in ePub, doc, PDF, txt, DjVu formats. You may reading Uf200 prober manual online or load.
- Most significant machine model for 300mm wafers
High precision, high rigidity, high throughput machine. - Better cost performance for 300mm wafers.
- 300mm Framed wafer & CSP handling machine.
- It is the prober with high-speed probing that targets non-memory device.
- Most significant machine model for 200mm wafers
High precision, high rigidity machine. - Highly efficient, High throughput, wafer & CSP handling machine.
Better cost performance machine. - High-speed machine for discrete.
- 200mm Framed wafer & CSP handling machine
- Accretech Probing Machine for full wafer testing on a single touch down. Developed with capability to simultaneously measure on 12 stages with dedicate XY stage and POGO tower.
- Consolidated management of the operation of probing machines for higher operation rate.
- This network allows you to consolidate the management of resources with the user host.
- The GEM Network System supports standards based on the SEMI standards to achieve factory automation at customers.
- This is a group of dedicated terminals for increasing the efficiency of test areas.
TSK UF3000 was developed to be the de facto standard model for the semiconductor testing process that accurately meets these needs. It is a fully automatic, ultra-high function probing machine that meets the total range of customer requirements including high-mix low-volume production for System LSI etc. or mass production for memories etc.
In addition to the high-rigidity of the machine, the probe mark inspection (PMI) features an automated adjustment sequence to guarantee 100% probe to pad contact.
The UF3000 increases through-put with ease of probe card conversion, quick set-up and improved processing capability. This enables rapid integration into 300mm wafer mass production lines.
The machine received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency), and we have already received 60 orders. The company will use its established advantage as the No.1 supplier in this field to promote the adoption of UF3000 in 300mm wafer mass production plants.
Uf300 Prober Manual 2016
High-spec wafer probing machine UF3000
Uf300 Prober Manual Online
Features
1.High through-put
The new high performance CPU helps to decrease set up time.
Multiple CPUs allow for parallel processing to decrease overall lot process time.
2.Easy Operation
Easy conversion of probe cards
Easy set up of parameters through new Touch To Go (TTG) function. Also supports multiple languages. Selecting a new language can be done without reboot.
New image processing system enables probe to pad alignment, probe mark inspection and self-diagnostic functions.
Compliant with 200 mm and 300 mm wafers on one load-port.
3.Ultra precision
Probe alignment is conducted at same height as actual probing, thereby minimizing any Z – axis error.
For ultra high rigidity, UF3000 uses a 4 axes driving mechanism (QPU: Quad Pot Unit) for Z – axis.
OTS (Optical Target Scope) enables measurement of the relative position of the cameras with absolute accuracy.
Total Accuracy
within ±2µm
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